Liquid Cooling Engineering Guide for High-Density Data Centers
Liquid cooling can remove more heat than air cooling at very high rack densities. Before selecting a technology, a facility should review the heat load per rack, the coolant architecture, the secondary loop and the responsibilities of each supplier.
This page is an Engineering Guide. VERHI’s current published product database does not show a VERHI liquid cooling product line, so VERHI does not claim to supply every liquid cooling architecture. VERHI can review the project requirements and confirm which part of the cooling chain can be supported after engineering review.
Cooling Chain Questions
- expected kW per rack and IT load profile
- direct-to-chip, cold plate or rear-door heat exchanger requirements
- CDU and secondary loop ownership
- facility water or coolant supply conditions
- redundancy and maintenance requirements
- integration with precision cooling or in-row cooling
Evidence Links
Insights for background only: Liquid Cooling Data Center: Why Micro-Module Facilities Are Making the Switch, 液冷数据中心：向微模块部署的转变, Liquid Cooling Data Center: The Future of Micro-Module Data Centers, 液冷数据中心：为何微模块设施现在正纷纷采用这种技术.
Current published cooling evidence: Precision Cooling Products, In-Row Precision Cooling Products.
Liquid Cooling FAQ
What is liquid cooling for data centers?
Liquid cooling uses fluid to move heat away from high-density IT equipment more efficiently than air in specific architectures.
Which liquid cooling options are suitable for AI?
The suitable option depends on kW per rack, server design, facility conditions and CDU requirements. VERHI should review the complete chain before making a recommendation.
Does VERHI support liquid cooling?
VERHI does not currently claim to support every liquid cooling type. Submit your rack density and cooling chain for an engineering review to confirm the support boundary.
—
